16 mrt. 2006
1 minuut
With a new sense of urgency fuelling the global transition to lead-free, the electronics group of Henkel presents its comprehensive lead-free product range.
With the deadline to Go Lead-Free now less than a few months away, a major priority will be the implementation of compliant processes. With a new sense of urgency fuelling the global transition to lead-free, the electronics group of Henkel presents its comprehensive lead-free product range. This incorporates the Multicore solder paste, flux and wire solutions and Loctite surface mount adhesives – designed to withstand the greater rigors of lead-free wave soldering whilst preventing chip loss. In addition, Henkel presents a range of Hysol underfills, dam & fill encapsulants, die attach adhesives and semiconductor molding compounds, again all optimised for the elevated lead-free process temperatures.
The lead-free transition is also fuelling the growing demand for compatible material sets, delivered by suppliers who manage every stage of the manufacturing process. “The imposition of environmental concerns does not remove the need to continually decrease manufacturing cost and maintain fast product development cycles for consistent product reliability and compatibility,” comments Frank Ongkiehong, Henkel’s director of Application Engineering/Management. “It is for this reason that modern manufacturers are increasingly adopting our material sets, incorporating Henkel’s renowned expertise at every stage – from semiconductor package material compatibility all the way through to board level assembly.”